Used SPEEDFAM 9B-5L-IV #9188364 for sale

ID: 9188364
Vintage: 1994
Lapping machine 1994 vintage.
SPEEDFAM 9B-5L-IV is a wafer grinding, lapping and polishing equipment. It is specifically designed to ensure efficient and precise machining of both large and small semiconductor wafers. The system features an automated process flow which is designed to reduce operator intervention and to streamline the entire unit. The grinding process is completed using 9B-5L-IV's high speed diamond-tipped grinding wheel. This wheel spins at an optimal speed to ensure that the entire surface of the wafer is quickly and correctly machined. The wheel is also incredibly precise, enabling the machine to conduct low-toleranced operations, such as thinning, over-layering, ultra-fine texturing, and lapping. SPEEDFAM 9B-5L-IV also features a five-point precision tool that can be mounted onto the grinding wheel. This tool allows the operator to make precise adjustments while grinding. In addition, the tool also offers several customizable settings, including speed, rotation, and depth, to ensure the utmost accuracy regardless of the job requirements. The lapping operation is completed using the 5L-IV's specialty lapping plates. These plates are perfect for grinding small flat surfaces without jeopardizing the overall integrity of the wafer. The plates are able to create a uniform and consistent surface that is free of blemishes and irregularities. The final step of the process is the polishing stage. 9B-5L-IV uses a special abrasive to polish the wafer to the highest possible finish. The asset is also equipped with a real-time monitoring model that allows the operator to track the progress of the polishing process. This ensures that the wafers are accurately polished and the desired process results are obtained. Overall, SPEEDFAM 9B-5L-IV is a reliable and efficient wafer grinding, lapping, and polishing equipment. It is not only precise and user-friendly, but also customizable and easy to use. Furthermore, its automated process flow eliminates the need for manual intervention, ensuring that every wafer is perfectly and swiftly machined.
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