Used SPEEDFAM 9B-5L-IV #9208833 for sale

SPEEDFAM 9B-5L-IV
ID: 9208833
Vintage: 1995
Single side wafer lapping system DPG Platen: 2.2 kW Direct lead 1995 vintage.
SPEEDFAM 9B-5L-IV is an automated equipment for wafer grinding, lapping and polishing. This machine is specifically designed for use in the precision processing of semiconductor wafers for device fabrication. 9B-5L-IV is an open-architecture, modular system, which facilitates manufacturing versatility and helps reduce costs. It features a five-axis CNC automation unit for precise control of wafer shapes and shapes of finished parts. The machine uses a robotic arm and a quick-change tool-holding tool to reduce operator fatigue and minimize setup time. SPEEDFAM 9B-5L-IV combines three key wafer processing processes into one compact asset. The first process is grinding, which involves the use of diamond grinding wheels to reduce the thickness of the wafer. The second process is lapping, in which a combination of abrasive and polishing media is used to obtain very high-accuracy flatness, roundness, parallelism and surface finish. The third process is polishing, which utilizes a hard and soft abrasive and polishing media to achieve superior optical characteristics. All three processes are performed in a closed model, which eliminates contamination of the wafer and ensures a repeatable and consistent results. The equipment employs precise temperature control and precise pressure control to obtain superior surface finish. 9B-5L-IV is put through rigorous performance tests to ensure utmost accuracy and repeatability with each batch of wafers. The modular design of SPEEDFAM 9B-5L-IV allows the machine to be quickly adjusted for different wafer sizes. Its advanced diagnostics and programmable user interface offer continuous monitoring and troubleshooting capabilities, as well as helpful reminders and guidance for the operator. The system can be monitored remotely via its Ethernet connection, allowing for remote support, troubleshooting and diagnostics. 9B-5L-IV is a viable solution for wafer grinding, lapping, and polishing among chip-making or MEMS (micro electromechanical systems) fabrication industries. It combines three critical processes into one machine, and its open architecture and advanced diagnostics help to reduce costs and improve quality assurance. SPEEDFAM 9B-5L-IV is an efficient and reliable unit for precision processing of semiconductor wafers.
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