Used SPEEDFAM 9B-5L-IV #9208859 for sale

SPEEDFAM 9B-5L-IV is a wafer grinding, lapping and polishing equipment designed for high-precision applications. The system features a proGran™ grinding chamber equipped with the latest generation of wafer-grinding technology. This ensures optimal performance for grinding opaque and/or ultra-thin wafers to the tightest tolerances. The unique proGran™ grinding chamber also boasts superior thermal control and dynamic balancing, capable of limited grinding of large wafers up to 135 mm. 9B-5L-IV is powered by a brushless DC motor and advanced connectivity options for digital communication and networking. This unit is driven by a high-power, high-performance 5-stage lapping process, capable of producing sub-micron uniformity with a maximum flatness specification of +/- 5μm. The machine also provides excellent surface uniformity with an RZ of 0.2-.3um. SPEEDFAM 9B-5L-IV is backed up by a proprietary IntelliPol™ polishing tool, providing users with a complete PZT wafer polishing solution. The IntelliPol™ asset is designed to offer precise polishing with low stresses on the wafer and offers users the ability to adjust pressure distributions, low pressures, variable speeds and recirculation of the polishing slurry. Users can also integrate their cleaning, rust removal and surface grinding processes into the model as required. 9B-5L-IV also includes a range of advanced wafer handling facilities, ensuring the safe and efficient handling of wafers throughout the entire process. The equipment can be configured with an automated chuck rotation process, using the latest available technology to ensure precise wafer positioning and secure loading. Users are able to access a web-based monitoring system for monitoring and controlling the unit's performance. This includes real-time PZT temperature and pressure readings, time usage data and machine performance metrics. Overall, SPEEDFAM 9B-5L-IV wafer grinding, lapping and polishing tool is an ideal solution for those looking to achieve the highest level of precision wafer processing. The asset offers users an extensive range of features, including sophisticated wafer handling, lapping and polishing capabilities as well as advanced monitoring and reporting features. This combination of features makes the model suitable for industries including semiconductor fabrication, aerospace and automotive engineering and medical device manufacturing.