Used SPEEDFAM 9B-5L-IV #9223160 for sale

SPEEDFAM 9B-5L-IV is a wafer grinding, lapping and polishing equipment designed to finish wafers with a high-quality surface finish. This machine uses a combination of high-speed grinding, lapping and controlled polishing to produce a highly accurate and precise wafer surface. 9B-5L-IV is capable of operating in three modes - grinding, lapping and polishing. Grinding is the first stage of the process, carried out with the wafer between two rotating abrasive plates. This process is used to remove material and smooth out any surface roughness. The achievable surface roughness during grinding is typically 5 - 10 nanometers. Lapping is the second stage of the process, carried out on a flat surface while the wafer is moved in a controlled manner across the surface. This is done with diamond laps and an abrasive paste, and is generally used to achieve less than 0.25 nanometers of surface roughness. Polishing is the third stage of the process, and is used to give the wafer a high-luminescent finish. SPEEDFAM 9B-5L-IV is equipped with a polishing wheels that can be adjusted to accommodate different wafer sizes. The polishing process can achieve a surface roughness of less than 0.1 nanometers. 9B-5L-IV is an efficient and versatile wafer grinding, lapping and polishing system, capable of producing high-precision, high-quality wafers with a surface finish that meets the requirements of various industries. The unit is easy to operate and allows you to adjust the speed of the grinding, lapping and polishing process, as well as the load, which allows for better control of the end result. With a compact design and low power consumption, it is an ideal choice for companies looking for a wafer grinding, lapping and polishing machine.