Used SPEEDFAM 9B-5L-IV #9223964 for sale

SPEEDFAM 9B-5L-IV is a high-precision, multi-tool wafer grinding, lapping and polishing equipment designed for processing semiconductor wafers and other delicate electronic components. It offers a combination of lapping, grind and polish functions with the ability to rapidly switch heads for processing multiple substrates. 9B-5L-IV is capable of sub-micron level accuracy and is ideal for high-precision semiconductor fabrication. SPEEDFAM 9B-5L-IV system consists of a precision X-Y stage, a lapping head to grind the wafer, and a polishing head to produce a clean surface finish. The X-Y stage can be programmed to move the wafer in a specific profile or to follow a programmable mathematical curve. The lapping head utilizes a diamond-tipped grinding wheel to precisely reduce the wafer surface. The polishing head utilizes diamond particles of varying size to finish the clean the surface. 9B-5L-IV is capable of grinding wafers with a minimum diameter of 6 mm with a minimum grinder shaft speed of 4,500 RPM. The lapping and polishing process may be conveniently applied with the programmable automatic control feature which allows for operation of the machine in either a manual or automatic mode. SPEEDFAM 9B-5L-IV comes with two separate water jets that allow cleaning or deburring of the surface prior to lapping. This feature ensures that the highest quality results are achieved even when working with very small feature sizes. 9B-5L-IV features a user friendly touch-screen display and is supported by a powerful industrial control unit with manual overrides. The machine also features manual eccentricity control of the grinding/polishing processes as well as tension control of the grinding/polishing heads. The tool's design makes it a reliable choice for all lapping and polishing applications, even in the most demanding environments. The asset also comes with a wide range of accessories for increased flexibility, including a standard flat wafer chuck and a checkered plate wafer holding device. SPEEDFAM 9B-5L-IV is an ideal choice for all applications requiring accurate, high-precision grinding, lapping and polishing of microcomponents. The model is highly reliable, easy to use and programmable, and compact for easy installation in a wide variety of environments. 9B-5L-IV provides a cost-effective solution for manufacturing operations requiring highest quality results.