Used SPEEDFAM 9B-5L-IV #9224518 for sale

SPEEDFAM 9B-5L-IV Wafer Grinding, Lapping, & Polishing Equipment is a multi-functional, multi-use polishing system designed to meet the needs of the semiconductor and electronic device industries. 9B-5L-IV unit utilizes a combination of planetary grinding and lapping discs to effectively smoothen, flatten, finish, and polish various surfaces. The result is a superior, high quality, ultra smooth surface finish which is essential for optimal operation of sensitive devices. SPEEDFAM 9B-5L-IV machine features a large working envelope and can process flat or contoured surfaces up to eighty-five millimeters in diameter. The tool includes a heavy duty, portable table top design that is easily installed in a vertical or horizontal orientation for flexible installation. The unit utilizes diamond abrasives in a variety of grits to achieve the desired surface finish for each application. The table top design also includes removable faces plates to accommodate larger work pieces, making it very easy to switch between applications. 9B-5L-IV asset includes a three-station grinding/polishing unit that features manual and motorized grinding/polishing options, allowing the user to adjust the cross-feed and vertical travel of the grinding and polishing head. The model includes a variable speed pulley drive, which enables the user to adjust the grinding and polishing speeds up to a maximum of 5,000 RPM. The motorized drive can be programmed to automatically adjust the cross-feed and vertical travel of the grinding and polishing head, allowing for uniform grinding and polishing of even extremely complicated surfaces. SPEEDFAM 9B-5L-IV equipment includes a precision lapping and polishing device that utilizes a combination of lapping and polishing plates to achieve an ultra smooth, uniform surface finish. The lapping plates are connected to the main unit via a pair of locking mechanisms, which allow the user to quickly and easily switch between different lapping plates as desired. This allows the user to select the ideal lapping plate for each application, resulting in optimal results. In addition, 9B-5L-IV system includes an optical flat, allowing the user to measure the flatness of the surface being processed. This allows the user to quickly and easily assess the flatness of the given surface, and make adjustments as needed in order to achieve the desired surface finish. SPEEDFAM 9B-5L-IV Wafer Grinding, Lapping, & Polishing unit is an ideal choice for those who demand consistent, excellent results. The machine combines precision grinding and polishing with lapping for complete surface finish optimization, all within a single, easy to use tool.