Used SPEEDFAM 9B-5L-IV #9311814 for sale

SPEEDFAM 9B-5L-IV is a high-performance, industrial grade wafer grinding, lapping & polishing equipment used for planarization and fine precision grinding of semiconductor wafers. This system utilizes the latest multi-directional spindle grinding techniques to provide greater accuracy and speed for optimal results. In addition, this unit is equipped with a 5-axis motorized head to provide high-precision input angles and angles of attack. 9B-5L-IV utilizes an advanced grind tool designed to enable high speed processing while delivering superior results. This machine can accommodate up to two individual grinding stations and each can be individually configured to suit the material being processed and the desired outcome. Additionally, this tool is designed to reduce particle contamination and minimize handling of the wafers. The in-built control asset ensures precise grinding angles while the tool holders offers an effective and versatile tool and abrasive holder and can be easily changed between different grinding modes for greatest flexibility. The model incorporates several advanced features to help ensure optimal operation such as temperature control, stainless steel polishing table, an infra-red heater to prevent oxidation during processing, automated storage and inventory tracking, and an optional vacuum equipment for wafer contamination control. The combination of these features make SPEEDFAM 9B-5L-IV the ideal system for various semiconductor device fabrication processes. Furthermore, this unit is capable of quickly switching between grinding and polishing modes to offer the best possible results. In terms of engineering design, 9B-5L-IV is highly advanced and capable of producing superior, highly consistent wafer grinding and polishing results. The carrier head is equipped with adjustable pressure pads to ensure an even surface finish and optimal wafer grind quality. Additionally, sophisticated sensors are included to ensure that grinding and polishing parameters are maintained resulting in consistent surfaces finishes and improved device performance. The machine is also equipped with robust tooling and fixtures to support the loading and unloading of wafers to and from the carrier head. Furthermore, an integrated tool magazine allows for quick changes between grinding and polishing modes and makes it easy to switch different types of abrasives. Additionally, the whole tool has low noise operation and user-friendly features to make the asset fast and easy to use. Overall, SPEEDFAM 9B-5L-IV is an advanced and highly advanced, industrial-grade wafer grinding, lapping and polishing model designed for accurate and cost-effective semiconductor device production. Highly consistent, and repeatable results are easily achievable thanks to the advanced features and user-friendly design of the equipment. Consequently, 9B-5L-IV is ideal for use in any semiconductor production environment.