Used SPEEDFAM 9B-5L/P-IV #9189205 for sale

SPEEDFAM 9B-5L/P-IV is a high-performance wafer grinding, lapping, and polishing equipment. It is designed to deliver precise and uniform surface finish of semiconductor wafer substrates and other components through a multi-step process. This system features two independent pressure cassettes, a variety of interchangeable polishing pucks, and a programmable servomotor to provide lapping force. The unit features a high-efficiency, low-vibration drive motor with digital control and feedback services, ensuring precise and smooth wafer motion. The two pressure cassettes allow for different lapping force and surface finish parameters, enabling the machine's capability to accommodate a range of product requirements. A two-step lapping and polishing process is possible with the 9B-5L/P-IV, enabling consistent and high-quality surface finishes. The 9B-5L/P-IV is also equipped with a range of interchangeable polishing pucks, which are configurable to accommodate different component sizes. Using these pucks, this tool is able to obtain different kinds of wafer patterns and profiles, enabling customization for finer levels of product detail. Additionally, it also features a coil motion thermal control unit, which can be used to prevent overheating and ensure reliable performance over long-term operation. In conclusion, SPEEDFAM 9B-5L/P-IV is a reliable and powerful wafer grinding, lapping, and polishing asset. Its multi-step lapping and polishing process, adjustable pressure cassettes, and programmable servomotor provide excellent precision and reliability of results. In addition, its range of interchangeable polishing pucks offers further customization capabilities, making it suitable for a wide range of product requirements.