Used SPEEDFAM 9B-5L/P-IV #9381872 for sale

SPEEDFAM 9B-5L/P-IV wafer grinding, lapping and polishing equipment is an innovative, automated production-level unit designed to meet today's tight process requirements in the semiconductor industry. Its robust construction and components guarantee optimal performance and reliability in a wide range of wafer fabrication and finishing operations. This includes the precise grinding, lapping and polishing of wafers with consistent results. The system utilizes a high-torque spindle motor and a speed controller to allow for accurate and reproducible rpm speed and feed rate. SPEEDFAM 9B-5L/P-IV offers a range of features, as follows. Variable RF-amplitude allows for quick adjustment of grinding/lapping and polishing speed. Vibration dampening unit ensures extremely quiet and vibration-free operation, while a unique spindle design reduces heat buildup. Independent speed and force control enables optimal wafer grinding and polishing results. Modular multi-tasking head offers the versatility to switch quickly between different tasks. Fully enclosed grinding and polishing chambers maximize safety of operators and protect electronic components inside the unit from dust and chips generated during wafer fabrication operations. In addition, this model features an integrated computer control machine, giving users the power to easily configure the machine according to their needs. The tool can be adjusted according to the wafer size to enable different wafer processing operations. It also offers automatic wafer loading, automatic recovery from power outages and automatic shutdown after completion of each task. Overall, SPEEDFAM 9B-5L/P-IV is an industry-leading solution to a wide range of wafer grinding, lapping and polishing needs. It offers precise, reliable, and reproducible grinding, lapping and polishing results for high-quality production. Its robust construction, range of features, and integrated computer control asset make it the perfect choice for today's demanding processes.