Used SPEEDFAM 9B-5L-T #9398252 for sale
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ID: 9398252
Double sided lapping machine
Diameter lapping plates, 25"
4-Way drive motion:
Upper plate
Lower plate
Carrier sun driver gear
Carrier ring
Driver gear all in rotation
Maximum clearance upper and lower plates, 18"
Thickness of abrasive machining plates, 1.2"
Motor-driven carrier sun gear reversing system
Automatic thickness control
Pressure system III
Variable speed control with slow start and stop system
Precision lifting / Pressure control air cylinder with proximity sensor
Geared carriers for durability
Nickel plate ring and sun gears
Steel upper plate drive
Stainless steel exposed hardware and table edging
Epoxy-coated drain system
Aluminum slurry ring
Inching
Hour meter with reset option
Digital readout timers
Automatic slurry distribution
Analog tachometer
2-Hand safety control
Paint: SPEEDFAM White
Lower abrasive machining plate speed: 6-60 RPM
Upper abrasive machining plate speed: 2-20 RPM
Workpiece carrier speed: 3-21 RPM
(5) Workpiece carriers
Carries diameter: 7-¾"
Main drive motor: 3 HP
Sun gear carrier driver motor: ½ HP
Control circuit power supply: 110 V
Power supply: 230 V, 3 Phase, 60 Hz.
SPEEDFAM 9B-5L-T is a multi-function grinding, lapping and polishing equipment specifically designed to meet the needs of semiconductor, optical, and package substrate processing. The system consists of a 9-inch disc grinding wheel on a vertical spindle, a 5-inch lapping wheel on a horizontal spindle, and a 5-inch variable speed turntable. These three components are capable of performing a variety of operations including cross-sectional grinding, end-view grinding, back-lapping, side-lapping, and polishing. The 9-inch disc grinding wheel is designed to grind wafers as thin as 3mm and as thick as 10mm. The 5-inch lapping wheel can accommodate wafers between 0.4mm and 1mm thick, with a maximum size up to 150mm in diameter. The turntable uses a grease lubricated pneumatic table for static holding power, allowing for superior grinding and polish results. 9B-5L-T is controlled by a user-friendly programmable controller that monitors and adjusts the spindle speed, table speed, and feed rate. This allows the user to accurately process the desired parameters to achieve the desired results of the application. The unit is enclosed in a cabinet to provide protection against dust and debris and a high-pressure coolant is used during process to keep the grinding wheels free of chips and burrs. The variable speed motor and spindles used can generate a maximum speed of 20,000 rpm to ensure accuracy and precision. The machine is constructed with a high quality stainless steel frame and aluminum alloy components and includes a grinding guard and antimagnetic gloves for user safety. It also features various input/output connectors and a central control panel with LED indicators for easy monitoring of the tool. SPEEDFAM 9B-5L-T is designed to accommodate a variety of wafers and substrates such as silicon, ceramics, and metals. It is also available with optional accessories for specific application needs. The asset is designed for fast and efficient grinding, lapping, and polishing for achieving superior surface finishes.
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