Used SPEEDFAM 9B-5L #9143836 for sale

SPEEDFAM 9B-5L is a precision wafer grinding, lapping and polishing equipment, designed for applications requiring high throughput and uniformity. With an advanced dual-stage grinding system, SPEEDFAM 9B5L offers fast, consistent and simultaneous grinding of substrates up to 6 inch in diameter. An on board polishing unit delivers superior uniformity of polishing results faster than traditional multi-stage polishing machines. The unique oscillation machine, which drives the abrasive belt grinding process, provides ultimate control over polishing force, velocity and machines smooth operation. 9 B-5 L features a dead zone-free drive roller design, a lightweight, corrosion-resistant tooling base and an innovative double-axle support structure for application rigidity. The dual-stage setup provides fast and uniform grinding and lapping results in a single-pass operation, even with complex workpiece contours. Further, its no-resplicing configuration eliminates the need to replace the abrasive belts during operation, resulting in increased throughput and job consistency. For clean and efficient operation, SPEEDFAM 9 B-5 L includes a full process monitoring tool with real-time feedback and automated process control. The machine's intuitive graphical human-machine interface (HMI) puts critical process parameters to control grinding, lapping and polishing results within a single screen for easy access. The user-friendly navigation of the menu enables users to quickly set parameters for processing and process optimization. The asset's unique air scrubber purifying model creates clean air flow to reduce dust particles and other debris, ensuring clean, safe operation in the production environment. The noise level has been reduced by more than 80% with acoustic insulation built in to the machine for low noise operation. 9B5L offers advanced technology combined with superior performance, enabling high quality wafer grinding, lapping and polishing solutions for industrial applications. It can be used for two-sided application and one sided application, such as for solar cells panels, for high accuracy applications. Its portability, flexibility, automatic process control and other advanced features make it ideal for a wide variety of wafer grinding, lapping and polishing applications in the photonics, semiconductors, and medical device industries.