Used SPEEDFAM 9B-5L #9276628 for sale

SPEEDFAM 9B-5L is a highly advanced automative wafer grinding, lapping, and polishing equipment. This system is designed to produce incredibly precise wafer surfaces with unequalled repeatability. SPEEDFAM 9B5L is particularly suitable for the production of precision wafers used in advanced silicon integrated circuits and MEMS devices. 9 B-5 L utilizes a 12-axis Robotic Grinding Gantry for grinding and polishing operations. Depending on the production cycle, operators can choose from a variety of grinding wheels, including diamond-impregnated up to 320 mm diameter, and polyimide-bonded up to 220 mm. The Robotic Grinding Gantry is capable of performing a wide variety of grinding and polishing operations, from removing fine topographies to larger complex recessing and profiling. 9B5L is also equipped with a 5-axis Lapping/Polishing station. This station provides the ability to polish wafers to higher exact precision standards, which is essential in the production of ultra-precision wafers. The lapping/polishing motion is provided by a motor-driven cross member with linear encoders, achieving motion resolution of 0.01 microns with repeatability over multiple hundredths of microns. 9B-5L can accept wafers between 25.4-203 mm and accept tape, tapeless, and custom carriers. The entire unit is designed to be quite robust, and the robotic gantry is capable of lifting more than 25 kg. SPEEDFAM 9 B-5 L also offers flexible recipe management as well, allowing users to easily adjust parameters such as speed, pressure, and orientation throughout the operation. Overall, 9 B 5 L is an incredibly powerful machine for automating wafer grinding, lapping, and polishing operations. With its wide range of adaptable grinding wheels and precise lapping/polishing, this tool is capable of achieving ultra-precision results for advanced wafers. The asset's robustness and flexible recipe management make it perfect for any production task.