Used SPEEDFAM 9B-5P-5 #293633720 for sale

SPEEDFAM 9B-5P-5 wafer grinding, lapping, and polishing equipment is an advanced, high-precision wafer-processing solution designed to provide unparalleled accuracy, repeatability, and throughput. Offering a wide selection of grinding, lapping, and polishing heads and media, this cost-effective system is capable of driving production costs down by quickly and precisely processing multiple sizes of silicon and other materials. The main components of 9B-5P-5 unit are three fixed mechanical stages that feature low-vibration, direct-drive wafer alignment and toolless changeover. Each stage consists of a precision spindle, a multi-axis motion machine, a programmable spacing wheel, and a heavy duty aluminum frame, providing precise granularity and accuracy for wafer grinding and polishing tasks. The tool is equipped with a high-performance, load-independent linear servo stage for precise positioning, along with a high-dynamic, dual-action radial stage that allows for high-speed cutting of high-aspect ratio features. The asset also features an advanced, high-torque spindle that can reach up to 160,000 rpm (revolutions per minute), ensuring smooth and consistent results and minimal material loss. SPEEDFAM 9B-5P-5 is capable of producing speeds up to 4,500 rpm, making it fast enough to handle even the most demanding wafer grinding applications. With its integrated, high-accuracy grinding handles and feet, the model can efficiently grind, lap, and polish even the toughest materials without damage or deformation. Finally, 9B-5P-5 is simple to program and requires minimal operator interface. It is compatible with various software programs and is easily upgradeable as process or material needs evolve. Its auto-tune calibration equipment also makes it simple to adjust and fine-tune settings quickly, further reducing the overall cost of wafer grinding while achieving superior results.