Used SPEEDFAM 9B-5P-IV #9166107 for sale

SPEEDFAM 9B-5P-IV wafer grinding, lapping & polishing equipment is an automated, advanced processing system specifically designed to meet the demands of the semiconductor industry. 9B-5P-IV unit incorporates a unique combination of the best technologies from SPEEDFAM grinding, lapping & polishing products including superior abrasive technology, advanced robotic movement, state-of-the-art inspection technology and the most advanced process control and monitoring systems available. SPEEDFAM 9B-5P-IV machine is comprised of the DWG-6 grinding wheel, which utilizes abrasive particle sizes from 200 mesh (74 microns) down to 1 micron.The diamond wheel is precision balanced for quiet and consistent wafer grinding. Combined with precise robotic movement, the tool ensures maximum accuracy and quality when controlling thin film thickness. The DLSP-6 lap plate is utilized for wafer lapping and delivers superb uniformity and flatness with its low-friction, non-abrasive rubber cup. Specfam's 6 inch diameter lap plate provides a large surface area and a wide range of polishing capabilities that are ideal for semiconductor wafers. The DRP-6 polishing plate, utilizing a fiber filled resin-based material, is ideal for polishing and finishing wafers to the highest accuracy and anti-corrosive standards. 9B-5P-IV processing asset is equipped with an advanced vision model that can image each wafer individually and achieve complete global uniformity measurements in real time. The vision equipment is also integral for monitoring and controlling adaptive wafer processing. The process control software works in tandem with the system's vision unit to maintain accurate process control. SPEEDFAM 9B-5P-IV machine is capable of processing wafer sizes ranging from 2 inches to 8 inches in diameter, and also includes a patented wafer cleaning tool to reduce wafer breakage. Overall, 9B-5P-IV wafer grinding, lapping & polishing asset is a state-of-the-art processing model designed to meet the increasingly precise requirements of the semiconductor industry. The equipment's advanced abrasive technology, combined with its sophisticated process control and monitoring software, make it the perfect choice for grinding, lapping & polishing wafers to the most exacting precision.