Used SPEEDFAM 9B-5P-V #9223969 for sale

SPEEDFAM 9B-5P-V is a precision wafer grinding, lapping, and polishing equipment. The system is designed to meet the most demanding tolerances of modern semiconductor manufacturing processes. It is suited for the grinding, lapping, and polishing of substrates for the semiconductor industry such as silicon, gallium arsenide, and others. 9B-5P-V wafer grinding, lapping and polishing unit features a variety of process capabilities and configurations which can be customized for specific process needs. Configuration includes a 9 inch wheel diameter for grinding, three 5 inch diamond wheels for lapping, and five 1 inch diamond or silicon carbide electroplated wheels for polishing applications. Wheel rotation can be varied from 1,000 to 15,000 RPM to optimize the process. The machine is built on a heavy duty steel frame and vibration isolated to ensure stable and repeatable performance. The unit includes a closed loop coolant circulation tool to ensure each part is processed at the correct temperature, pressure, and flow. The wafers are held in place by a vacuum chucking asset with an adjustable pressure control. SPEEDFAM 9B-5P-V also features advanced graphical user interface (GUI). The controller includes an intuitive user interface which enables ease of use and speeds set up and operation of the machine. The software can be accessed from any computer with a network connection. The model is fully automatic and allows full control of process variables such as speed, time, force, coolant, and pressure. In addition, it also offers multiple recipe and process control features such as automated chucking, timer, fixed or random process variables, and recipe management. 9B-5P-V wafer grinding, lapping and polishing equipment is a valuable tool for semiconductor fabrication and production. It enables manufacturers to produce parts with high accuracy and consistency, minimizing scrap losses and optimizing cost effectiveness. The advanced GUI and automatic operations result in enhanced yield, higher quality, and improved throughput.