Used SPEEDFAM 9B-5P #9352976 for sale

SPEEDFAM 9B-5P is a wafer grinding, lapping, and polishing equipment that is capable of finishing various substrates such as silicon, SiGe, III-V, and single or multi-layer films to a range of flatness, parallelism and surface finish specifications previously unattainable with conventional methods. The system is built upon a carrier platen which consists of two plates and a top platen for holding the wafer specimen. Compressed air supplied to three regulator valves controls the feed rate and dressing rate of the wafer specimen. A diamond wheel is used to grind the wafer specimen and a cross-feed mechanism supplies the pressure required for grinding. A stylus type selector mechanism is used to select the grinding, lapping, and polishing parameters depending upon the wafer substrate being processed. The unit comes equipped with a constant pressure lapping machine and a water cooled polishing tool which ensures a consistent finish on the wafer surface. The asset also features a position-detection-type traverse mechanism allowing for correction and adjustment of the workpiece. 9B-5P is also equipped with a closed-loop optical feedback model which can continuously monitor the grinding and polishing process. This ensures a consistent finish with repeatable results for each batch of wafer specimens. SPEEDFAM 9B-5P is well suited for semi-conductor and optical device manufactures who need to achieve a high level of flatness and surface finish for their components and who may not have the resources to invest in a full scale polishing equipment.