Used SPEEDFAM 9B-5P #9384219 for sale

SPEEDFAM 9B-5P is a wafer grinding, lapping & polishing equipment developed by SPEEDFAM Corporation, a leading provider of grinding and polishing equipment for thin-film applications. 9B-5P is an automated device designed to process and finish semiconductor wafers for cell production. It is capable of processing a variety of sizes and thicknesses of wafers, ranging from 150 to 250mm in diameter. The system consists of an upper and lower table assembly, grinding and lapping gear, spindle motors, and an automated process controller. The upper table assembly consists of a support plate, hand wheel and a height adjustment knob. The lower table assembly includes a swivel arm, a lapping plate and a positioning plate. The grinding and lapping gear consists of a diamond grinding wheel and a polishing pad, both designed for high-precision, multi-directional operations. The spindle motors are capable of rotating the grinding and lapping gear up to 3,000 RPM, while the automated process controller coordinates and regulates the process to ensure the maximum quality production. It also reduces any human error that may occur during the wafer finishing process. SPEEDFAM 9B-5P unit is well-suited for the fabrication of storage cells, integrated circuits and other forms of high-performance microelectronic packaging. It is capable of grinding, lapping and polishing the wafers to meet the most stringent quality standards for thin-film applications. The machine is also capable of producing high-volume production with minimal cycle times, making it an ideal solution for manufacturers with high production demands. Overall, 9B-5P is a reliable wafer grinding, lapping and polishing tool that offers high-precision processing and fast cycle times. It is capable of producing top-tier wafer components for a variety of thin-film applications and is well-suited for manufacturers with demanding production requirements. With its advanced features and automation capabilities, SPEEDFAM 9B-5P is one of the leading systems for wafer production and processing.