Used SPEEDFAM 9B-5SSG-IV #9103362 for sale

SPEEDFAM 9B-5SSG-IV is a complete wafer grinding, lapping and polishing equipment that provides reliable and cost-effective production of ultra-smooth, single-sided and double-sided polished wafers. The system has a single-phase, adjustable-speed, three-phase, AC-motor drive unit, allowing it to adjust the speed and grinding pressure for optimal results. The machine features a 9-inch (228mm) grinding/lapping wheel, a high-precision diamond lapping/polishing pad, and a precision air bearing spindle. The tool is capable of polishing up to 8-inch (203mm) wafers with a single-side ground and polygon-shaped front surfaces. 9B-5SSG-IV utilizes an advanced control asset with multiple sensing and monitoring capabilities. This model provides the ability to monitor and control process conditions including control of pressure, temperature, pressure vs. time, and various accessory settings. This equipment also monitors the condition of the lapping pad, which enables it to measure the amount of abrasive remaining on the pad. This ensures consistent and reliable performance. The unit is designed to accommodate a variety of processing techniques including cutting, grinding, lapping and polishing. The system utilizes electroplated diamond grinding wheels to achieve precise, controlled grinding and polishing. It also has the ability to measure the surface roughness of the wafer, thereby ensuring the best possible finish. Additionally, the unit can be modified for use with several different grinders as well as a wide variety of lapping plates. The machine is also capable of lapping using abrasives such as diamond or cerium oxide. In addition to the tool, SPEEDFAM provides a range of accessories to further customize SPEEDFAM 9B-5SSG-IV to meet specific customer requirements. This includes a wide range of process consumables such as grinding and polishing consumables,lapping fluid, pads, abrasive and disposal containers, as well as grinding disks, liners and holders. The asset is also designed to integrate with existing production lines and to accommodate various process requirements and industry specifications. Overall, 9B-5SSG-IV is a reliable and robust model designed to efficiently and effectively deliver ultra-smooth, single-sided and double-sided polished wafers with a precise and consistent, high-quality finish. The equipment is capable of handling a wide variety of processes and materials, features multiple monitoring capabilities, and can be customized to meet customer-specific requirements. The system is ideal for mass production and high-precision applications.