Used SPEEDFAM 9B-5SSG-IV #9105516 for sale

SPEEDFAM 9B-5SSG-IV is a versatile grinding, lapping, and polishing machine for machining single-sided, double-sided, and thin edges. This equipment is designed specifically to address stone and semiconductor applications of various materials such as silicon and GaAs. The high speed of operation makes it useful for a variety of materials, including mm-wave wafers, as well as die-level and chip-level substrate lapping. This system utilizes two horizontal end poles for abrading, lapping, or polishing. These horizontal end poles are adjustable and can be set to adjust the tilt and diameter of the rotational axes. The grinding stones are installed on the horizontal end poles and are fit to the substrates to provide the desired grindstone shapes. The grinding stone rotates around the fixed axis controlled by a stepping motor. The adjustable grinding stone shape is designed to accommodate not only the desired grindstone shape but also the desired grinding speed. 9B-5SSG-IV features programmed operation of both grinding and lapping procedures. The grinding is programmed with pulse width modulation to which the diameter and the angle of the machine are adjusted in a synchronized manner. The grinding is also programmable for controlling the number of passes in order to achieve the desired effect. The lapping is designed to provide both single sided and double sided lapping of the substrates. The grinding stones provided in SPEEDFAM 9B-5SSG-IV vary from 70 nm to 20 μm, depending on the application, and are designed to last longer and to provide excellent surface finish. The programmed operation and the uniform lapping process combine with the grinding stones to produce a consistent and uniform finish. 9B-5SSG-IV unit can be used for both simple and complex lapping operations. The easy-to-understand control panel helps users in setting up and programming each operation with just a few steps. To further enhance productivity, this machine can also be fully automated to take full advantage of multiple lapping operations. SPEEDFAM 9B-5SSG-IV provides a cost-effective and reliable solution for wafer grinding, lapping, and polishing operations in semiconductor fabrication. Its versatility comes from its advanced features, such as a mechanically adjustable horizontal end-pole machine, adjustable grinding stone shape, and its high speed. This machine is backed with excellent customer service support for operation and maintenance and can help in ensuring an optimal product output.