Used SPEEDFAM 9B #293639912 for sale

SPEEDFAM 9B is a wafer grinding, lapping and polishing system that is designed to achieve superior performance and uptime in an affordable and compact footprint. The machine is capable of processing wafers up to 300 mm in diameter, making it suitable for applications in the semiconductor, MEMS and optoelectronic industries. It is controlled by an easy-to-operate, intuitive user interface with a graphical touchpanel display for simple setup and control. This model offers both a manual and automatic grinding option, with the latter providing a much smoother and faster cycle time. It also features a built-in programmable timer that can be set to shut down the machine when the job is done. With the integrated grinding arm, the machine can be adjusted accurately to the desired wafer shape and size, ensuring quality results. SPEEDFAM reliable and efficient operation is backed by high-grade components, such as a hardened steel dust door and high-tolerance spindles. The dust door prevents contamination of the wafer and keeps the grinding process clean, while the spindles are sealed for longer life and enhanced performance. To further ensure quality grinding results, the system is configured with an automatic lapping carriage and primary, secondary and tertiary grinding arms. The lapping carriage is especially noteworthy for its precision timing and speed, allowing for hassle-free and quality lapping of wafers. Each grinding arm has its own motor, enabling optimal grinding of materials at different speeds for a more consistent finish. SPEEDFAM 9 B is also notably integrated with advanced cooling systems optimized for efficient and prolonged grinding operations, without overheating. 9B is an efficient, reliable and straightforward wafer grinding, lapping and polishing system. With its compact footprint, automated and advanced features and cost effectiveness, it is an ideal choice for achieving superior quality output with minimal downtime in a variety of manufacturing operations.