Used SPEEDFAM 9B #293656101 for sale

SPEEDFAM 9B is a wafer grinding, lapping and polishing equipment designed for ease-of-use, higher throughput and improved process repeatability in semiconductor, MEMS, opto-electronics, research and defense industries. The low-vibration, non-contact abrasive processing method provides superior surface finish and achieves a finish far superior to manual polishing. The grinding and lapping process is initiated by SPEEDFAM 9 B software, which regulates the grinding and lapping wheel motion, spindle motion, and also defines the depth of penetration of the material during grinding and lapping. The grinding and lapping head is programmed to follow the desired contour and provide equal pressure over the entire surface area of the wafer. 9B system is equipped with a versatile tool-changing unit, allowing for quick tool changes and setup for different wafer sizes and process parameters. A high-precision lapping table enhances accuracy by registering the wafer position and assuring proper wheel centering. 9 B's microprocessor-controlled automatic control keeps the spindle speed and platen face acceleration constant, while providing precise end point monitoring. The data collected in this process is used to control the grinding pressure, send signals to the machine after each grinding and lapping operation, and provide automatic interactive feedback, mid-term and scheduled calibration, and re-registration of the platen face. SPEEDFAM 9B utilizes an advanced water-soluble abrasive media to eliminate material run-off and maximize the uniformity of the finished surface. This tool provides a wide range of finishing options while eliminating environmental risks caused by particle accumulation and fugitive dust. The asset is designed with safety and ease-of-use features, such as multiple levels of protection and a user-friendly touch-panel interface. It is also compatible with existing hardware and software platform, ensuring easy operation and quick integration into the production environment. SPEEDFAM 9 B is a powerful and efficient wafer grinding and lapping solution for achieving precise and uniform surface finish in a safe and reliable manner. With a host of automated features, the model is designed to save time, reduce costs, and improve yield for a wide range of production applications.