Used SPEEDFAM 9B #293661598 for sale

SPEEDFAM 9B is a wafer grinding, lapping and polishing equipment that offers state-of-the-art design and performance. SPEEDFAM 9 B system employs a range of features and technology to multi-task semiconductor wafer processing and finish processes including flat lapping, smoothing, final polishing, and grinding. 9B unit features a 1200 rpm spindle motor with hydro-static bearings that allow for long term, vibration free, precise wafer processing. The motor is able to accommodate a spindle height range of 6" to 12". This machine also features a double jointed arm design which permits easier control of loading and unloading, while also reducing the temperamental sensitivity found in traditional jointed arm designs. The process incorporates the use of diamond grinding wheels and lapping plats. Diamond lapping plates are designed to be used for the bulk back-thinning of wafers and the processing of other hard to machine surfaces. Fine lapping plates and diamond grinding wheels along with water soluble lubricants, are used to provide even and consistent surface finish. 9 B tool is easy to use and set-up. It comes with an intuitive, user-friendly, touchscreen interface panel that allows the user to control essential process parameters such as grinding path, grinding pressure, surface finish, and motion control. Extraordinary performance is possible due to SPEEDFAM 9B's integrated high-speed motion control asset with dynamic digital control of speed and torque. This model guarantees repeatable, highly accurate wafer processing that is impossible to achieve with manual grinding and polishing machines. SPEEDFAM 9 B is a reliable equipment designed with the end-user in mind. Data collection and performance monitoring is highly simplified thanks to 9B's intuitive operation control software allowing the operator to monitor in-process metrics and track process data. The data collected is then stored electronically for detailed analysis and long-term process improvement. To summarize, 9 B is a wafer grinding, lapping and polishing system that offers improved performance, speed, and precision compared to traditional systems. The robust design, intuitive interface, straightforward setup and advanced speed control make SPEEDFAM 9B a comprehensive wafer processing solution.