Used SPEEDFAM 9B #9100161 for sale

SPEEDFAM 9B Wafer Grinding, Lapping & Polishing equipment is an advanced, state-of-the-art processing system for high precision wafer processing. SPEEDFAM 9 B unit is capable of grinding, lapping and polishing a variety of substrates, such as silicon, ceramic, glass, and hard metal. It provides a superior finish, high degree of repeatability, flexibility, cost-effectiveness and intense throughput. 9B machine features a number of components, including a grinding head which is designed for direct coupling to motorized spindles. The grinding head is a horizontal, direct drive spindle unit, which is capable of providing high accuracy grinding, lapping and polishing of wafers. The grinding head is also equipped with an ultra-precision grinding wheel with options for different abrasives. The machining capability of 9 B tool is further enhanced by an on-board removable pressure plate, a vacuum pickup plate for wafer loading and alignment, and additional tooling options. The advanced SPEEDFAM 9B asset also features an advanced, fully programmable control unit. This control unit is capable of providing control over the grinding, lapping and polishing process. It provides the operator with the ability to program and store various processes, which then allow for improved flexibility. Additionally, SPEEDFAM 9 B model can be configured for various machining conditions, enabling it to process different materials. 9B equipment is capable of achieving consistent and accurate results, thanks to its long-lasting, durable components. The grinding head is built with a robust, strong construction, allowing for a robust performance over a long period of time. Additionally, the system has a range of additional safety features, such as adjustable speed, power, pressure and vacuum set points. 9 B Unit is suitable for a variety of applications, including precision grinding, lapping and polishing of substrates such as silicon, ceramic, glass, and hard metal. The machine can be employed across a range of industries, for the production of optoelectronic devices, semiconductor chips, optical components, and many other types of wafers. The tool is easy to install and operate, and offers the highest degree of performance, cost-effectiveness, and throughput.