Used SPEEDFAM 9B #9180942 for sale

SPEEDFAM 9B Wafer Grinding, Lapping & Polishing Equipment is a highly advanced, precision system designed for industrial-grade lapping and polishing operations. SPEEDFAM 9 B model offers a number of exceptional features that make it ideal for a wide range of wafer grinding, lapping and polishing operations. The unit has a flexible modular design that allows for easy customization to specific applications. It comes with easy to use software, allowing for a wide variety of grinding and polishing options. 9B can be used for flat or curved surfaces of a variety of substrate materials, including metals, composites, and glass substrates. It has an inverted design so that the lapping plates stay in contact with the substrate, while the spindles are located underneath the wafer. This design ensures uniform contact with the wafer, allowing for consistent results. The machine also provides precise feedback control, allowing for repeatable results. It has an array of additional features to make wafer grinding, lapping and polishing operations more efficient. It has a high-torque water pump to provide a coolant flow for each spindle. The water pressure can be adjusted to optimize grinding conditions and to prevent any damage to the wafer. The tool also includes a wafer temperature monitoring asset to ensure that the wafer is kept at the optimal temperature during the grinding process. 9 B also includes a number of safety features to reduce the risk of injury. It has an automatic shut-off feature when the lapping plates reach a pre-defined pressure level. This feature ensures that the wafer does not become too hot or too hard. The model also has a guard to protect the user from potential injury while reaching deeper into the grinding action. SPEEDFAM 9B Wafer Grinding, Lapping & Polishing Equipment is an efficient and reliable system for industrial-grade lapping and polishing operations. Its modular design and powerful features make it an ideal choice for achieving consistent and precise results. It is easy to operate and its safety features provide added protection to operators. This unit is sure to deliver high-quality results for a variety of wafer grinding, lapping and polishing operations.