Used SPEEDFAM 9B #9228125 for sale

SPEEDFAM 9B is a wafer grinding, lapping, and polishing equipment designed for high-precision surface processing. It is ideal for grinding and polishing wafers from any size and material. The system features an integrated computer control with a high-resolution graphical user interface (GUI). This enables users to perform multiple tasking easily and quickly. SPEEDFAM 9 B includes a powerful polishing motor for uniform motion and fast, reliable results. It can easily process wafers of up to 12" in diameter with a polishing spindle speed of up to 4000 rpm. The unit also features a diamond-polyurethane polishing pad for efficient wafer grinding, lapping, and polishing. 9B offers several advanced features to enable high-precision processing. It includes a load cell and automatic pressure control machine for superior surface lapping and polishing accuracy. The tool also features an automated polishing process for processing wafers of different sizes and materials. This enables users to quickly program the machine for the desired application. 9 B also offers an optional laser processing asset for precision control of the surface of wafers. This model utilises a multi-beam laser for precise photoablation and nanofinishing. Additionally, SPEEDFAM 9B is capable of capturing images of wafer surfaces using a microscope for detailed analysis of the surface. This enables users to troubleshoot and optimize the wafer polishing and lapping processes. SPEEDFAM 9 B is a complete equipment for surface treatment. The system is designed to provide reliable operation, consistent repeatability, and outstanding results. It is perfect for both low and high volume production of wafers.