Used SPEEDFAM 9B #9230404 for sale

SPEEDFAM 9B model is a high-precision, all-purpose wafer grinding, lapping and polishing equipment. It is designed to mechanically grind, lap and polish semiconductor wafers to a high degree of uniformity and accuracy. SPEEDFAM 9 B is aimed primarily at the production and processing of silicon, compound, II-VI and III-V wafers. 9B features an integrated outer frame, designed to minimize vibration and improve accuracy. The main frame and central vertical spindle can be adjusted according to the size of the wafer being processed. Wafers are mounted to the spindle and can be rapidly indexed around the center of the grinding area to achieve even grinding. 9 B has a grinding area which encompasses a diamond-embedded grinding wheel, a carrier plate, and the bonding and grinding plate. The carrier plate holds the wafer in place during grinding, while the diamond-embedded grinding wheel handles the bulk of the work. The bonding and grinding plate is fixed to the grinding area, and is used to keep the wafer firmly in contact with the diamond-embedded grinding wheel. SPEEDFAM 9B also comes with a variable speed drive, which allows for precise speed control over the grinding process. SPEEDFAM 9 B is specifically designed for use in the semiconductor industry. It has a temperature-controlled heated surface, which ensures that the wafer is not affected by thermal shock. Additionally, 9B features a cooling system which keeps the surface of the grinding area below the point at which oxidation can occur. This prevents the wafer from being damaged. 9 B is designed in such a way that it can be operated either manually or semi-automatically. It features a variety of safety features and an automatic unit which allows users to control the grinding process up to a single revolution. This machine can be further customized depending on the needs of the user. Overall, SPEEDFAM 9B is a powerful and reliable wafer grinding, lapping and polishing tool, which is ideal for use in the semiconductor industry. It provides a precise, uniform and accurate grinding and polishing process, enabling users to produce high-quality semiconductors without the need for frequent maintenance or adjustments.