Used SPEEDFAM 9B #9274778 for sale

SPEEDFAM 9B is a state-of-the-art wafer grinding, lapping and polishing equipment. It is designed for mass-production of silicon wafers. This system enables larger throughput with reduced cost-per-wafer while providing superior finishes. The lapping component of the unit utilizes a simultaneous, multi-station, six-point contact lap ring. This is combined with a novel rotating clamshell to simultaneously apply pressure to both sides of the wafer at once. This helps ensure a consistent height and smooth surface finish for each wafer. The grinding component of the machine is a two-stage process. The first stage uses a high-speed, spindle-mounted grinding wheel that is designed to minimally disturb the wafer's surface. This ensures a near perfect finish while maintaining the wafer's form. The second stage is a one-pass lapping and polishing step that uses a belt and disc setup to produce the highest quality finish on the wafer. SPEEDFAM 9 B also features several advanced safety features to ensure the safety of the operator. It is equipped with an automatic emergency stopping feature that stops the tool in the event of an unexpected error or incident. It also has an air-intake suction asset to protect against dust particles and fume particles from entering the model. 9B's integrated automated equipment makes it ideal for high-volume wafer production. Its advanced features and state-of-the-art technology ensure a superior finish and uniformity on each wafer. Furthermore, its design makes its easy to maintain and operate, enabling increased efficiency and cost savings.