Used SPEEDFAM Auriga C #9139520 for sale

SPEEDFAM Auriga C is an innovative piece of equipment designed for wafer grinding, lapping, and polishing. This grinding and polishing equipment offers high accuracy and repeatability for the fabrication and processing of a variety of substrates. Auriga C is capable of lapping and polishing wafers from 8 to 150mm in size and with a thickness of up to 0.3mm. SPEEDFAM Auriga C features an advanced controller and software package that offers a range of performance and process capabilities. The system's grinding and polishing operations can be adapted precisely to produce superior results. Its automated operator consoles and material handling systems provide ultimate flexibility and simplify workflow and reduce labor costs. Auriga C is designed to provide the utmost in accuracy and repeatability in wafer grinding and polishing. The unit is equipped with robust, precision-engineered components such as a three-axis CNC positioning table and an automatic wafer indexer. This ensures that the machine can consistently produce highly accurate and repeatable results. SPEEDFAM Auriga C is also designed to be easy to use. The intuitive user interface and automated material handling tool makes it simple to set up, operate, and monitor. Its advanced safety features include interlocks, movement sensors, and chemical process control. The asset automatically monitors the process parameters and provides alarms in case of deviations from the set parameters. Finally, Auriga C is equipped with high-quality grinding and polishing consumables that are designed to offer consistent results. The consumables minimize the risk of contamination and oxidation while providing superior practical performance. SPEEDFAM Auriga C is an ideal choice for wafer grinding, lapping, and polishing needs. Its state-of-the-art technology, accuracy, repeatability, and reliability make it an ideal choice for production of high quality substrates.