Used SPEEDFAM Auriga C #9222188 for sale

SPEEDFAM Auriga C is a wafer grinding, lapping, and polishing equipment designed to finish single-sided and double-sided silicon wafers with unprecedented quality and speed. Auriga C features a unique CNC-driven polishing head that smoothly finds the optimal cutting path even in tight processing areas. The head ensures that crystal damage on the wafer is minimized and takes full advantage of the CNC's high acceleration and simultaneous drilling, lapping, and polishing capabilities. The system also supports wafer edge grinding, enabling the production of wafers with edges thinner than the conventional grinding limit of 10μm. SPEEDFAM Auriga C's high-precision cassette-feeding mechanism can accommodate up to 20 cassettes for uninterrupted processing of a large number of wafers. Its high-powered motor and heavy-duty gearbox, combined with its powerful, digitally controlled grinding and lapping spindle and efficient spindle-tilting mechanism, ensure superior machining speeds. The CNC also offers fully automated diamond wheel dressing, maximizing the production of perfect and uniform flatness. Other features of Auriga C include an advanced optics unit with hi-resolution color CCD vision cameras allowing for precise positioning and close tolerance lapping and polishing. The grit dispensing machine allows for accurate and efficient delivery of working material to the polishing platen, while automatic load-indication provides for precise tracking of wafer progresses. Also, its integrated safety guards keep the operator safe while protecting surrounding objects from contamination. SPEEDFAM Auriga C is designed for extreme precision and maximum speed in high-volume production processes. Its combination of accuracy and speed make it an ideal choice for wafer processing in semiconductor fabrication plants. Its rugged construction, advanced safety systems, and proven reliability make it the perfect choice for wafer processing applications.