Used SPEEDFAM Auriga EC #141545 for sale
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ID: 141545
Post-CMP cleaner
Extened range of PH for cleaning applications, including HF use.
SPEEDFAM Auriga EC is a fully automated wafer grinding, lapping, and polishing equipment designed for precise grinding and polishing of semiconductor wafers. It is designed to retain precise surface flatness and lateral accuracy with ultra-precise lapping and polishing quality. Auriga EC is an advanced machine tool that offers the potential to reduce process times, improve yield, and improve surface flatness accuracy by using a piezoelectric-drive system. The main components of SPEEDFAM Auriga EC include an upper head assembly that houses the grinding, lapping, and polishing semiconductor wafers, a large grinding/planing table, and a lower rotating table that grinds and planes wafers simultaneously. Auriga EC is equipped with a variety of different heads and tools that are tailored to the user's process and application requirements. These include the Diamond Planetary Lapping Head, the Wafer Grinder, the Linear Lapping Machine, the Planetary Plane Polishing Head, and the Single Wafer Polisher. SPEEDFAM Auriga EC is designed to achieve precise semiconductor flatness, surface roughness, and lateral accuracy. Auriga EC is built with a patented CCD laser line curvature measurement unit, allowing for precise measurement of surface flatness with high accuracy. Additionally, thanks to its high-powered oscillating motor, SPEEDFAM Auriga EC can achieve flatness levels within 0.4nm. Auriga EC also features an internal air filtration machine that cleans and maintains optimal air quality during processing and removes any chemical contaminants fully. SPEEDFAM Auriga EC also includes a built-in automatic wafer chucking tool that accurately and precisely positions the wafer in the machine. In addition, Auriga EC has extensive data logging capabilities, allowing users to store, analyze, and review data generated during the grinding, lapping, and polishing of the wafers. Finally, SPEEDFAM Auriga EC is a cost-effective and efficient solution for semiconductor wafer grinding and polishing. It is a highly customizable and user-friendly asset that is equipped with advanced features and capabilities. Auriga EC ensures precise flatness, surface uniformity, and lateral accuracy that are essential for the production of semiconductor wafers.
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