Used SPEEDFAM Auriga EC #9198717 for sale

SPEEDFAM Auriga EC is a wafer grinding, lapping and polishing equipment designed to enable superb precision in microprocessing techniques. This powerful system is capable of grinding, lapping and polishing wafers from 20μm to 200μm in size, including all shapes of wafers including circular flat wafers, tapered wafers, double sided wafers, and ceramic wafers. Furthermore, Auriga EC can handle wafers up to 200ºC surface temperature, with a variation of up to 20ºC. SPEEDFAM Auriga EC is powered by an intelligent control unit with superb precision. This machine ensures accurate wafer positioning and optimization for both grinding and polishing operations. The tool is also capable of simultaneous double side processing, meaning that it can handle up to two multiple wafer configurations on each side of the toolhead. This wafer grinding, lapping and polishing asset is designed to deliver the highest quality results with accuracy and speed. It is able to act not only as a grinding tool but also as a polishing tool for wafers with higher levels of accuracy. This wafer grinding model also has a range of features which allow for easy user control of the grinding process. Features such as both manual and automatic grinding control allow users to select the most appropriate grinding process for their situations. In addition, Auriga EC also has an ergonomic design which allows it to be safely and efficiently used in any work environment. Furthermore, SPEEDFAM Auriga EC's robust construction and built-in safety features make it the perfect choice for any demanding wafer processing application. Its stainless steel construction and heavy duty components ensure the longevity of the machine and its performance. Finally, the machine is also equipped with a variety of sensors which allow it to detect any irregularity in the wafer grinding, lapping and polishing process and notify the user immediately to enable remedial action. This ensures the highest quality results with minimum waste.