Used SPEEDFAM Auriga #9114132 for sale

SPEEDFAM Auriga is a versatile wafer grinding, lapping and polishing machine. This state-of-the-art equipment provides precise and efficient planarization and defect removal of semiconductor wafers with its advanced motion control technology, powerful driven spindles, and dynamic non-contact air bearing capacities. Auriga platform features a wide range of features and capabilities, including micro-step control for incremental movement, powerful spindle motor, closed loop speed control, and automatic tool exchange. This ensures consistent, high precision wafer grinding, lapping and polishing. In addition, the machine is capable of working with various types of substrates due to its quick and easy changeover process. SPEEDFAM Auriga is designed for optimum capacity, throughput, and efficiency throughout the production cycle. It uses six spindles to provide optimal grinding, lapping, and polishing of the wafers. Each spindle is capable of controlling up to two axes, which allows for quick and easy adjustment of the grinding forces. Furthermore, a multi-directional motion feature increases the operational flexibility of Auriga system. SPEEDFAM Auriga is constructed with a wide variety of advanced materials, including stainless steel, aluminum, and a combination of the two. This material structure ensures a durable and reliable performance for the duration of its lifetime. The maximum grinding range of Auriga is 2895 by 2357 mm, providing a variety of options and support for the most demanding applications. SPEEDFAM Auriga unit utilizes its advanced motion control technology, allowing for dynamic response to multi-axis coordinate moves. The precision operation of the machine and its robust construction have been proven to be more reliable than those of conventional grinding systems. Furthermore, various feed, form, and edge correction algorithms offer the user versatility in grinding capabilities. Auriga is also able to grind wafers using multiple grinding techniques, including lapping, grinding, and polishing. With its advanced technology, it provides an efficient and safe option for a wide range of semiconductor wafer grinding, lapping and polishing requirements. As its spindles and non-contact air bearing operate in a closed loop control environment, the machine provides enhanced accuracy and precision in graining and lapping of wafers. In short, SPEEDFAM Auriga provides advanced grinding, lapping and polishing capabilities for an array of semiconductor wafers. Its robust construction, precise motion control, powerful motor, and non-contact air bearing, make it a reliable and efficient machine for achieving the highest quality results.