Used SPEEDFAM BT64 #9289258 for sale

SPEEDFAM BT64 is a versatile wafer grinding, lapping and polishing equipment capable of processing virtually any type of wafer up to 200mm in diameter and 0.2mm thick. The system provides a low-cost, yet highly efficient solution to processing various types of wafers including silicon, III-V compound, and ceramic. BT64 utilizes a numerically controlled grinding and lapping head. This head is powered by a stepper motor and utilizes a pneumatically actuated arm to lift and lower the grinding/lapping wheel. In addition, the head incorporates an encoder to precisely regulate the speed of the spinning wheel. The head also features an adjustable air cushion mounted above the grinding/lapping wheel to facilitate fast and efficient wafer handling. SPEEDFAM BT64 also features a programmable wafer mapping table. This unit allows the user to quickly enter in parameters such as number of wafers, wafer size, and desired end product specifications. The machine then automatically calculates the number of passes, gap settings, wafer speeds and other necessary parameters for successful polishing and grinding. The tool is equipped with two polishing platters for grinding/lapping operations and one polishing platter for polishing operations. The polishing platters can accommodate different grades of polishing pads, which are available in various sizes and materials to meet the needs of various wafer types. For lapping operations, water lubrication is used to reduce friction on the wafers and to avoid creating any static electricity. In addition, BT64 is outfitted with a vacuum asset. This model helps to remove grinding and polishing media from the equipment as well as wafer debris. It also assists in maintaining a clean environment for the grinding/lapping and polishing operations. SPEEDFAM BT64 is capable of achieving ultra-smooth surfaces on the wafers, as well as highly uniform thickness over the wafer's entire surface area. This makes it particularly suitable for the manufacture of high-performance semiconductor devices. Furthermore, BT64 is designed to meet strict environmental standards and is capable of running in an automated manner for extended periods of time, making it an efficient and cost-effective solution for wafer grinding, lapping and polishing.