Used SPEEDFAM CMP-V #293647749 for sale

SPEEDFAM CMP-V is a equipment designed for grinding, lapping and polishing semiconductor wafers. It combines grinding, lapping and polishing steps into one single process, allowing for the highest possible quality of the finished product. The system features an integrated polishing head with a built-in filter, a polishing bench and a unique advanced power control unit. The advanced power control machine enables CMP-V to maintain a constant polishing speed, even with changing loads, being able to adapt polishing power automatically in order to provide a smooth, uniform finish. This tool is ideal for polishing complex wafer designs, such as those found in modern integrated circuit applications. The polishing bench of SPEEDFAM CMP-V is tensioned for optimum pressure control and it also allows for an additional contact surface to be securely fitted to aid in polishing. The filter of the asset is designed to minimize particles that could contaminate the polished wafers. It offers an anodized aluminum barrel which can combine polishing slurry and air, to be jetted out of the filter and onto the polishing point and through the polishing bench. CMP-V is suited for both main stream and advanced applications in the semiconductor industry. It is effective in grinding and lapping thin silicon wafers, optical substrates and many other materials. Its compact and easy-to-use design and its extreme precision, high surface quality and fast processing times makes SPEEDFAM CMP-V an ideal model for any semiconductor fabrication and product processing tasks.