Used SPEEDFAM CMP-V #9300427 for sale

SPEEDFAM CMP-V is a wafer grinding, lapping and polishing equipment designed for the high precision machining of surfaces on semiconductor wafers. It is a comprehensive system with advanced technology features which enable high-precision machining and processing of flat surfaces and deep trenches on the wafers, with accuracy of less than one micron. It is used in the fabrication and production of semiconductor and microelectronic components. CMP-V is a fully automatic unit which can run both batch and single wafers. It includes a bridge and tilt-table machine to position the wafer for grinding, lapping and polishing. The bridge and tilt-table tool can be adjusted to accommodate various wafer sizes and thicknesses. It also features a closed-loop control asset which continuously monitors and adjusts the grinding, lapping and polishing process by using advanced control algorithms. The model also features a high-precision, air-bearing spindle powered by a brushless DC motor which is used for the grinding, lapping and polishing of the surface of the wafer. It includes a manually adjustable abrasive slurry feed equipment to control the rate at which the grinding and lapping processes are performed and an adjustable lapping speed control which optimizes the process. The system has an advanced coolant unit with programmable cooling times to ensure optimum cooling during the grinding and lapping processes. It also features a built-in coolant filtration machine which filters out any contaminants from the coolant and keeps the tool running optimally. For safety, the asset includes an external power switch, a coolant pressure switch, emergency stop buttons, and an RS485 interface which allows the model to be monitored remotely. SPEEDFAM CMP-V provides precision machining of wafer surfaces and high-quality surface finishes, with repeatability within one micron. It is an ideal choice for use in the fabrication and production of semiconductor components.