Used SPEEDFAM DSM 12B-8L #9029930 for sale

SPEEDFAM DSM 12B-8L is a wafer grinding, lapping and polishing equipment used for creating perfect surfaces on computer chips and other electronic components. This machine uses diamond particles, diamond polishing wheels, and a wide range of other precision cutting tools to grind, polish, and lap the surface of the wafer to exact specifications. The 12B-8L offers an 8-inch wafer grinding and polishing capability for wafers up to 100mm in diameter. This machine has numerous attachments and accessories that can be added to customize each operation; some of these include an interchangeable chuck system for different size wafers, a wafer de-warper to remove any warp from the surface of the wafer, an optical scan stage to inspect the surface, and a pressure sensor to ensure that the same amount of force is used when grinding each wafer. This model offers superior accuracy, repeatability, and reliability than other comparable machines in its class. It utilizes a state-of-the-art CNC controlled diamond turning unit, which allows for precision cutting along with excellent feedback control and consistent results. Its integrated cooling machine also allows for efficient heat removal during long cutting operations. A central-controlled hydraulic tool enables manual and automatic operation and a wide range of settings for cutting, grinding, and lapping. DSM 12B-8L offers optimal production efficiency for wafer grinding and polishing, making it the ideal choice for high volume semiconductor manufacturers.