Used SPEEDFAM DSM 16B-5L/P #9233199 for sale

SPEEDFAM-IPEC DSM 16B-5L/P Wafer Grinding, Lapping & Polishing Equipment is a highly versatile machine, designed for superior performance and accuracy. This system has a number of advantageous features that help it to produce consistent results, enabling it to outperform the competition and achieve the highest levels of precision. The unit is designed for the highest precision grinding and lapping, as well as polishing of a wide variety of materials, including semiconductor wafers. SPEEDFAM-IPEC's patented diamond disc technology ensures uniform, accurate grinding over the entire surface. Additionally, with its 5-level platen layout machine, it is able to grind and polish up to five wafers in the same cycle, minimizing labor and time. The diamond disc tool, along with the Integrated Process Control asset, allows the user to calibrate and control the process with impressive accuracy, while the model's computer-controlled Command & Control software monitors and records data for review. The equipment also uses a variety of grinding and polishing consumables to produce top-quality surfaces with fine finishes and tight tolerances. SPEEDFAM-IPEC DSM 16B-5L/P System is designed to operate in a low load environment for greater user safety. It has several detection device and cut-off control functions that provide both safety and process protection. It also offers a range of performance monitoring features, such as temperature control systems that prevent thermal degradation during operation. An auto-stop unit also helps to ensure consistent results. Overall, SPEEDFAM-IPEC DSM 16B-5L/P Machine is a highly advanced grinding, lapping, and polishing tool that is designed for maximum accuracy and efficiency. Its numerous features, such as the diamond disc technology, command & control software, and performance monitoring, make it an excellent choice for achieving precision results.