Used SPEEDFAM DSM 16B-5L #9235617 for sale

SPEEDFAM DSM 16B-5L is a wafer grinding, lapping, and polishing equipment designed to provide a level of automation, precision, and versatility to expand the production capabilities of silicon wafer production lines. With the ability to perform grating, lapping, and polishing (GLP) operations on 6 inch (150mm) and 8 inch (200mm) wafers, this system is ideal for the production of state-of-the-art devices that require highly accurate and uniform silicon surfaces. This unit utilizes state-of-the-art CNC (Computerized Numerical Control) technology to precisely control the path of the abrasives used for material removal, allowing for extremely accurate lapping and polishing operations. The segments that make up the grinding head can be individually controlled, with the ability to perform both straight and spiral grinding patterns. This allows the user to tailor the grinding pattern according to the desired surface roughness and uniformity of the finished product. The segments can also be interlocked to allow for simultaneous grinding and polishing operations. DSM 16B-5L is designed to provide process control parameters such as total removal rate, individual wheel speeds, and polishing force. This machine also offers a wide range of parameters such as water spray, thrust pressure, and lubricant delivery, ensuring long-term process repeatability and consistency. The machine also comes equipped with a motion control tool that provides inherent control of temperature, vibration, and surface roughness during high speed grinding and polishing operations. The asset is designed for easy integration with existing wafer production lines, offering an intuitive graphical user interface that reduces operator training time and allows for a wide range of process settings to be easily optimized. The model also features a number of tools and features that allow users to determine the effectiveness of each process step, including automated process control, automatic recipe setting, end-of-process quality checks, and real-time monitoring of surface finish. These features help ensure high quality and consistent production results. SPEEDFAM DSM 16B-5L is a highly versatile and robust equipment that provides the demanding requirements of today's wafer grinding, lapping, and polishing operations. Its precise and user friendly design makes it the ideal choice for precision silicon wafer production.