Used SPEEDFAM DSM 16B-5L #9235618 for sale

SPEEDFAM DSM 16B-5L is a powerful, precision wafer grinding, lapping and polishing equipment used in the semiconductor, microelectronics, optics, and other industries. It is suitable for finish polishing of planar surfaces of silicon, sapphire, and other materials, making it a highly versatile system with a wide variety of applications. DSM 16B-5L consists of a main platform and several modular components such as the wafer cassette, pressure unit, and spindle and vibration assemblies. The main platform is the base of the machine and is incredibly sturdy. It is composed of an industrial grade, welded-steel frame and plate tool that is designed for long-term durability. The main platform can be configured with one or two spindles and vibration. The wafer cassette asset consists of a cassette tray for loading wafers into the model, a vacuum source, a lift mechanism, and a wafer transfer station. The pressure equipment applies precise uniform pressure to the wafers while working on them. It is powered by a high torque, three-phase motor, and a control system with accuracy of 0.1MPa. The pressure unit also has a temperature monitoring and control machine for fine tuning of the pressure applied to each wafer. The spindle and vibration assembly consists of a high-performance motor, durable bearings, a frequency response upto 5MHz, and a state-of-the-art vibration dampening tool. It is capable of handling high-torque material removal and fine lapping and polishing operations. SPEEDFAM DSM 16B-5L provides smooth, precise finishes to wafer surfaces and is able to control the surface roughnesses to within the requirements of semiconductor industry standards. It also offers a wide variety of macro settings, for example, the pressure, speed, and vibration setting can be adjusted to customize the grinding and polishing process for different types of wafer materials. This flexibility makes it an ideal choice for a wide range of applications.