Used SPEEDFAM DSM 16B-5L #9245378 for sale

ID: 9245378
Vintage: 1997
Lapper / Polisher With (2) motors MITSUBISHI PLC Touch screen Cast iron plates No groove.
SPEEDFAM DSM 16B-5L is a solution for any ultra-precise wafer grinding, lapping and polishing operation. This equipment simplifies the process of grinding, lapping and polishing wafers, allowing for increased throughput times and improved workpiece accuracy. This system is capable of grinding, lapping and polishing single-sided and double-sided wafers up to 10" in diameter, making it an ideal choice for a variety of wafer applications. DSM 16B-5L features a user-friendly programmable logic controller (PLC). This PLC is capable of controlling the various process parameters with accuracy and repeatability. The unit also includes a vacuum chuck and wafer cleaning station, which can be used to ensure part cleanliness prior to polishing. The belt table has a 30-degree tilt range, allowing users to position the wafer at any angle for the greatest accuracy. A wafer loader and coarse grinding station are also included, for easy loading of wafers and quick grinding of a large number of wafers. SPEEDFAM DSM 16B-5L is equipped with a precision lapping and polishing machine, which allows for precise and repeatable results. The tool has a dual head polisher head, which allows for simultaneous grinding and polishing of different parts. The asset also features a computer numerical control (CNC) polisher, which has a large selection of polisher profiles to facilitate unlimited possibilities in polishing wafers. Additionally, the model is capable of low-pressure, low-abrasion sub-micron polishing. DSM 16B-5L is designed to provide excellent accuracy and repeatability. The equipment operates at a temperature of 0 to 158 degrees Fahrenheit and has a wafer transfer speed of 12 to 18 inches per minute. In addition, this system is equipped with an integrated laser unit, which can be used to measure the flatness of polishing wafers with an accuracy of within 0.0001 inch. SPEEDFAM DSM 16B-5L is designed to provide users with a complete solution for their wafer grinding, lapping and polishing needs. Its high-precision capabilities, user-friendly PLC and wide range of process parameters make it an ideal choice for any operation requiring accuracy and repeatability.
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