Used SPEEDFAM DSM 16B-5L #9275877 for sale

SPEEDFAM DSM 16B-5L is a wafer grinding, lapping and polishing machine designed to provide comprehensive, multi-functional and reliable process solutions. This wafer grinding, lapping and polishing equipment is designed to perform all of the crucial steps in the process of microelectronic device fabrication and can easily be customized to match the requirements of any device that needs to be grinded, lapped and polished. DSM 16B-5L comes equipped with a wafer grinding station, a wafer lapping station, a wafer polishing station, and a pick-and-place station. The wafer grinding station of the system is capable of grinding and/or pre-grinding with speeds of up to 6,000 rpm and is powered by a DC motor for precise control. The unit also includes a pair of precise air bearings with linear stages and a motorized spindle to ensure accurate, repeatable and stable grinding. In addition, the machine is equipped with a vacuum chuck which offers a stable and reliable wafer transfer tool. The wafer lapping station of SPEEDFAM DSM 16B-5L is also equipped with a DC motor control as well as precise air bearings and linear stages for precise control of the lapping process. The asset also includes a range of polishing media, such as diamond slurry, silica slurry, and ceramic slurry, which can be used to achieve repeatable and precise results. The wafer polishing station of the model offers an efficient and repeatable surface polishing process with a number of different polishing heads available. The motorized spindles of this station can provide a rotation speed of up to 7000 rpm with a smooth and steady output. Additionally, it is equipped with a pair of precise air bearings with gripping fixtures for a secure and stable polishing process. Finally, the pick-and-place station included in the equipment enables it to automatically grab and insert up to 34 wafers with flexible handling. It is equipped with a number of precision motion axes, vacuum table manipulators, DC motors and small-scale valves, which allow for repeatable and precise wafer processing. Overall, DSM 16B-5L provides a comprehensive and reliable wafer grinding, lapping and polishing solution. It is designed to tirelessly and consistently provide superior process performance to meet the demands of the most rigorous microelectronic device fabrication tasks.