Used SPEEDFAM DSM 16B-5P-V #9148494 for sale

SPEEDFAM DSM 16B-5P-V Wafer Grinding, Lapping and Polishing Equipment is a state-of-the-art system that is designed to efficiently grind, lap and polish a wide variety of substrates and wafers. It utilizes a variable speed 4-axis CNC platform to provide precise and accurate grinding parameters, to produce wafers with a high quality finish. DSM 16B-5P-V is a 16-inch platform that is designed to accurately and precisely grind, lap and polish a variety of wafers. It features five independently controllable platens, a high-pressure lapping carriage, a high-pressure chamber, and an integrated air bearing spindle, giving it the ability to grind, lap and polish up to five wafers simultaneously. The unit is capable of grinding, lapping, and polishing up to 500 um of ultra-fine diamond abrasive particles at a rate of up to400 rpm. The machine can also accept various other abrasive substrates for fine and coarse finishes. The tool's variable speed motor ensures that the grinding, lapping and polishing process is consistently accurate and precise. SPEEDFAM DSM 16B-5P-V is designed to operate in a range of conditions including temperature, humidity, and vibration, and can be calibrated to meet the most demanding applications. It also benefits from several mechanical systems for safety, including a multi-point safety interlocks asset and an automatic production mode to ensure maximum accuracy and consistent high quality results over time. DSM 16B-5P-V also incorporates the most advanced computerized diagnostics technology to provide detailed analysis of model performance. The diagnostic equipment is capable of determining the cause of any errors or faults that occur and can alert operators to system maintenance issues. This helps to ensure that the product is performing at peak efficiency while helping to prevent costly repairs or downtime. The unit also provides real-time feedback to operators allowing them to monitor the progress of lapping and polishing operations. In summary, SPEEDFAM DSM 16B-5P-V is a highly advanced and precise grinding, lapping and polishing machine. It enables the processing of a wide variety of substrates and wafers with an even finer finish than would normally be possible with conventional methods and machinery. This ensures that the finished product is of the highest standard for a broad variety of applications.