Used SPEEDFAM DSM 20B-5L-II #293619194 for sale

SPEEDFAM DSM 20B-5L-II is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. The system employs high-efficiency grinding and polishing to attain high-quality finishes, allowing for increased throughput and accuracy as well as improved quality control. The unit is constructed with a rigid base and features precise, automated controls to ensure reliable results with minimal operator intervention. DSM 20B-5L-II includes a variety of features such as a rotary table with two working arms, a precise electric spindle apt for high-torque operations and an adjustable grinding pressure. The electric spindle can be easily set for fine pitch grinding, allowing for precise and uniform finishes to be achieved. Additionally, precise speed control is provided by the machine's three speed options. This not only allows the operator to work with a range of parameters, but also extends the useful life of the consumables. In addition, the machine also operates with a range of tooling options, meaning that it can accommodate a range of materials and substrates. SPEEDFAM DSM 20B-5L-II offers a host of advantages for wafer grinding, lapping and polishing. One of the key benefits of the machine lies in its usability. As an automated tool, it is incredibly straightforward to program and operate. It also features a waterproof cover and coolant asset to minimize operator fatigue and maximize safety. Furthermore, the model is equipped with a vacuum suction device to minimize dust and debris, while its integral design ensures optimal productivity with minimal setup. DSM 20B-5L-II has also been engineered to operate with maximum precision and reliability. Its strong base and innovative modular design mean that it is stable and rigid while also ensuring extreme accuracy. Its versatile controls also offer flexible adjustments to allow for user-defined parameters. The equipment can also easily be integrated with other methods of production, such as plasma dry etching. In short, SPEEDFAM DSM 20B-5L-II offers a superb solution for wafer grinding, lapping and polishing. Its innovative design and reliable performance combine to make it ideal for use in the semiconductor industry. Its automated controls and durable construction offer optimal productivity and accuracy with minimal effort, allowing for efficient processing and a high-quality finish. As a result, DSM 20B-5L-II is an excellent choice for those in search of a reliable and efficient grinding and polishing system.