Used SPEEDFAM DSM 22B-24B-5L #9366385 for sale

SPEEDFAM DSM 22B-24B-5L is a wafer grinding, lapping & polishing equipment from SPEEDFAM. It is designed to provide the optimal surface finishes for semiconductor wafers used in many applications such as integrated circuit components. The primary features of this system are its three unique machines for surface finishing. The framework consists of a rotary polisher, a lapping machine, and a grinding machine, each of which can be used to provide the necessary result. The polisher has a diamond surface polisher mounted on a rotary table. The lapping machine has an adjustable height and three simultaneous lapping points that provide a smooth, consistent finish. The grinding machine has a rotating table with a grinding wheel and uses diamond grinding disks to achieve the desired surface finish. The control panel is designed to regulate the speed and cutting force of the grinding and lapping machine. It also provides precision meter controls and the ability to set parameters to ensure the desired finish. The unit also includes a wet process from the closed loop recirculation machine. This helps to ensure a high quality, uniform finish and protects the optics from contamination. DSM 22B-24B-5L is also highly automated. It includes a graphical display and intuitive user interface, as well as a memory that enables operators to recall previous setups for frequently performed operations for quick changeover. SPEEDFAM DSM 22B-24B-5L is optimized for use with semiconductor wafer processing and is capable of providing a uniform highest quality finish of 15 microns with a flatness accuracy of 3 - 5 microns. This makes it ideal for use in high-precision work that requires a high level of accuracy and repeatability. The tool is designed to provide low-maintenance operation and is backed with a one-year warranty. It helps to minimize downtime and provides users with the ability to perform grinding, lapping, and polishing of semiconductor wafers quickly and accurately.