Used SPEEDFAM DSM 6B-6L #149749 for sale

SPEEDFAM DSM 6B-6L is a wafer grinding, lapping, and polishing equipment used in the semiconductor and MEMS industries. The system consists of a CNC frame which holds three independent process spindles, each with an individual drive unit, allowing up to three processes at different stages to run simultaneously. It also has several micro-abrasive jet lapping (MAJL) nozzles that are used to accurately sand and shape the wafer surface. It also has two laser scanners for scanning the wafer during the lapping process, allowing for precise control over the surface profile of the wafer. The unit is capable of producing wafers with very high precision and exceptionally low roughness, and can accommodate wafer diameters from 150mm to 300mm. The machine is powered by a high-performance vector controlled servo-motor and drivers that provide a high rate of accuracy and repeatability of the process. It is also highly efficient, with a low cycle time and a low environmental impact due to its short warm up time. The tool includes an automated wafer stock handling asset that allows wafers to be loaded, unloaded and transferred quickly and safely, with minimal effort. The model has several safety features, such as pressure sensors and safety interlock switches, to help ensure worker safety and reduce the risk of accidents in the work area. The equipment is designed for high accuracy and repeatability, and is able to produce wafers with high precision, even over large lot sizes. It is suitable for repeatable ultra-flat wafer grinding, lapping, and polishing processes, and is capable of producing wafers to very fine tolerances of 0.1 microns or less. The system is extremely robust, and offers superior process control and reliable operation. It is also user friendly, with a user-friendly graphic user interface that allows the user to quickly and easily setup and monitor the process. Overall, DSM 6B-6L is an excellent wafer grinding, lapping, and polishing unit that offers superior performance, high accuracy, and reliable operation. It is ideal for wafer production with high precision and excellent surface quality, and is easy to setup and maintain.