Used SPEEDFAM DSM 9B-5DPG #9233198 for sale

SPEEDFAM DSM 9B-5DPG is a planetary wafer grinding, lapping, and polishing equipment designed for a variety of applications. This fully-automated system features a single-ended spindle motor for precise surface grinding, lapping, and polishing of semiconductor wafers up to six inches in diameter. The unit allows for high-precision, low-defect wafer processing with its patented mechanical design. It features a cantilevered, single-ended spindle motor mounted on the Hi-Mach Exchange table to ensure smooth and precise operation. This unique, two-axis machine's compact design enables a large wafer capacity while occupying minimal space footprint. The tool also has an integrated two-axis linear lift assembly with a range of travel up to 400mm. The asset's intuitive, easy-to-use touch-screen interface provides users with simple control over a variety of advanced parameters that include grit feed rate, spindle speed, servoi-axes motion speed, starting position, dwell time, and tool pressure. It is further equipped with SPEEDFAM patented Optical Position Aid (OPA) that optimizes the accuracy of grinding and polishing processes. The comprehensive performance package includes a die attach station, lapping station, optionally a polishing table, and a separate table for die attach adhesive application. The die attach station supports manual operation and the lapping station can operate with either manual or automated forms of abrasive media and process parameters. The model is also capable of "re-tooling" from manual to automatic for a more efficient and productive grinding and polishing process. The equipment also features a comprehensive accuracy, performance, and safety package, ensuring highly-reliable operation and maximum safety. The system includes X, Y-axis temperature control, integral work lights at each die attach and lapping station for operator safety, full overload protection, and isolation of any part from potential contamination from the environment. DSM 9B-5DPG is a fully automated wafer grinding, lapping, and polishing unit that ensures high-precision, low-defect wafer processing with its patented mechanical design and intuitive, user-friendly touch-screen interface. With its comprehensive accuracy and safety features, the machine ensures smooth and reliable wafer grinding, lapping, and polishing for a variety of applications.