Used SPEEDFAM DSM 9B-5L-IV #9191611 for sale

SPEEDFAM DSM 9B-5L-IV is a wafer grinding, lapping and polishing equipment designed for semiconductor device fabrication. The system consists of an integrated platform which includes four process stations, a computer processor, a user control center and a wafer handling unit. This process machine is designed to be simple to use, operational and efficient. Each process station is equipped with its own advanced control tool and can be run independently or in unison. The four process stations include the primary grinding heads, lapping heads and polishing heads. The primary grinding heads are high-speed spindles that use abrasive media particles to grind the wafers into various profiles or shapes. These heads are also capable of applying a thin layer of diamond paste to the wafer's surface. The second process station includes a series of lapping heads that use diamond paste to gently lap the surface of the substrate to create a precise grain pattern. The third process station is equipped with polishing heads to further refine the surface of the wafer and reduce any imperfections. This station uses a polishing media to remove small surface imperfections as well as any remaining grinding debris. The fourth process station is used for final polishing of the surface of the wafer by using a post-processing or finish media. The sophisticated control asset allows users to program and monitor the entire process from start to finish. This model also includes a computer processor that can store the user's data and settings for rapid repeat processes. The user control center includes a touch screen for easy operation, along with an integrated user interface for programming and monitoring the grinding, lapping and polishing processes. Finally, the equipment includes a wafer handling system to transfer the wafers from station to station without any manual handling. This automated process reduces time, cost and errors associated with manual transfer. In conclusion, SPEEDFAM DSM9B-5L-IV is a highly advanced and advanced unit that can be used for precision wafer grinding, lapping and polishing. The machine consists of four process stations, a control center and a wafer handling tool. This asset is designed for efficient and high-performance production while ensuring repeatable process results.