Used SPEEDFAM DSM 9B-5L #9235615 for sale

SPEEDFAM DSM 9B-5L is a wafer grinding, lapping and polishing equipment used in semiconductor device fabrication and manufacturing processes. The system is designed for grinding, lapping and polishing wafers from thin to thick (4" - 12") and consists of a main control unit, along with a rotating spindle and flat turntable for precise wafer placement. The spindle is driven by a motor that rotates at variable speeds, allowing for precise control over the grinding, lapping and polishing process. The lapping and polishing process is carried out using a controlled combination of micron-sized abrasive particles, grain size or density, pressure, time and speed. The turntable is equipped with a variable speed control, allowing for manual speed alteration, as well as programmability through the main control unit. This allows for variations in the grinding, lapping and polishing process, allowing for customization and accurate processing of specific wafer configurations. DSM 9B-5L is equipped with a range of safety features, such as an Automatic Emergency Stop, and an oxygen-pressure safety valve to prevent excessive pressure buildup during the process. Other details, such as the use of anti-static coating in the grinder, as well as the inclusion of a dust collection unit, ensure that the work environment is safe and clean. The machine is also equipped with a wide range of testing and measurement equipment, from vibration meters and hardness testers to thickness gauges. This allows for detailed analysis of the wafer after it has been grinded, lapped and polished. In conclusion, SPEEDFAM DSM 9B-5L is a highly reliable and advanced wafer grinding, lapping and polishing tool, designed to process wafers of varying thickness and configurations. Accurate grinding, lapping and polishing is achievable due to the range of precision-based features, such as variable speed controls, safety features and testing and measurement equipment included with the asset.