Used SPEEDFAM DSM 9B-5L #9243835 for sale

ID: 9243835
Double side wafer lapping system.
SPEEDFAM DSM 9B-5L is a state-of-the-art tool designed for wafer grinding, lapping and polishing. This equipment is designed to provide maximum efficiency, quality, and reproducibility. It consists of a main UNIT, which performs grinding, lapping and polishing operations, and a SUPER DRESSER module for Diamond Polishing. The main platform of DSM 9B-5L is divided into zones for each operation: wi- fi grinding up to 5.1 µm, polishing up to 0.1 µm, and lapping up to 1.2µm. The platform is constructed with a stainless steel frame and an overlay of aluminum plates. Each zone is equipped with ceramic seals, providing a controlled grinding pressure for better throughput and lower out gas leakage. The UNIT is enclosed in an insulated chamber to minimize noise and ambient effects. Much of the grinding and polishing operations are automated. An inverted pneumatic grinding/polishing arm with 3-axis linear servo system ensures faster and higher precision with adjustable force. The SUPER DRESSER module is an integrated unit that offers precision and fast diamond polishing. It is equipped with the latest diamond polishing technology, giving it a high spin-coating speed up to 15,000 rpm. The diamond polishing plate is also designed to provide excellent polishing results with minimal damage to the wafers. In addition, it has a low temperature operation feature, which enables safe and non-destructive polishing for delicate materials. SPEEDFAM DSM 9B-5L is equipped with a touch screen control panel for manual adjustment of time, pressure and temperature, allowing for precise control of the entire unit. It also has advanced data management features with records of operations, process histories and alarm histories that help to maintain optimal performance. This wafer grinding, lapping and polishing machine also meets standards for cleanroom class 10 and offers performance and safety certifications such as CE and ISO. Overall, DSM 9B-5L is an excellent choice for wafer grinding, lapping and polishing. This advanced tool is capable of achieving high precision with efficient throughput, while providing the highest quality results.
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