Used SPEEDFAM DSM 9B-5P-IV #9166344 for sale

SPEEDFAM DSM 9B-5P-IV is a wafer grinding, lapping and polishing equipment designed with advanced engineering to yield superior results on a variety of substrates, including wafers. The overall system is composed of a supporting framework, wafer loading and unloading systems, a carriage that holds the individual wafer cassettes, optical surface measurement equipment, and a grinding, lapping and polishing unit. The carriage is designed to support up to ten wafer cassettes, each of which can hold up to eight wafers. The machine can process up to 80 20-inch wafers. The grinding, lapping and polishing tool consists of a motor-driven spindle that houses a grinding jaw and a lapping wheel, which are powered by regulated frequency drive. The spindle is supported by a stable frame which houses the control and safety mechanisms. The asset is automated, allowing the user to choose different angles and depths for grinding and lapping. Additionally, the model is equipped with a selection of variable speed settings to adjust for different kinds of wafers and/or surface finish requirements. At the end of the process, the equipment is able to measure surface roughness, particle size, and other related features. It can also detect any irregularities in the surfaces resulting from the grinding and lapping, such as burrs. Due to its features and capabilities, DSM 9B-5P-IV is suited for any application requiring precision surface finish of wafers. This system is ideal for industries including semiconductor, electronics, medical, and metal fabrication. Furthermore, its beginner-friendly user interface and wide array of automated features make it a perfect choice for research and academic institutions.